| Parameter | Our capability / requirement |
|---|---|
| Board thickness | ♪ 0.8mm – 3.2mm (for metal‑edge, 1.0‑2.0mm recommended)
|
| Edge plating width | ♪ ≥ 0.3mm continuous metal coating on side walls
|
| Copper thickness | ♪ 0.5oz – 3oz (base) ♪ Edge plating final copper ≥ 25μm (can be reinforced with extra plating)
|
| Edge plating methods | ♪ Castellated half‑hole ♪ Stamped hole + metal frame ♪ CNC routed + edge plating (select based on your design)
|
| Min. castellated hole diameter | ♪ ≥ 0.6mm ♪ Pad clearance ≥ 0.25mm (after V‑cut, half‑hole integrity guaranteed)
|
| Clearance for edge plating | ♪ ≥ 1.5mm from board edge to internal copper (to avoid short circuit during plating)
|
| Edge finish | ♪ HASL / lead‑free HASL ♪ ENIG (gold) ♪ OSP (if edge plating not required) (ENIG recommended for exposed edges)
|
| Solder mask | ♪ Must be removed from edge‑plating area (solder mask opening defined in Gerber)
|
| Surface flatness | ♪ ≤ 0.75% (for metal‑frame assembly) (ensures good contact with shielding cover)
|
| Maximum panel size | ♪ 600mm × 500mm (larger sizes possible with special arrangement)
|
